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سالهفتهIDTitleApplNoIPCApplicantSubgroupزیر گروهرشته شرحDescription
202601WO/2026/001655TRANSPARENT PHOTORESIST COMPOSITION AND PREPARATION METHOD THEREFOR, PIXEL DEVICE, SEMICONDUCTOR DEVICE, AND MODULE DEVICECN2025/099945G03F 7/004SHENZHEN BRTHRBORDER SEMICONDUCTOR MATERIALS CO.,LTD.PHYSICSفیزیکابزارها
202601WO/2026/002466OPTICAL SYSTEM, PROJECTION EXPOSURE SYSTEM, AND METHODEP2025/063384G03F 7/00CARL ZEISS SMT GMBHPHYSICSفیزیکابزارها
202601WO/2026/002488METHOD OF PERFORMING A QUALIFICATION ACTION ON AN EXPOSURE APPARATUSEP2025/064031G03F 7/00ASML NETHERLANDS B.V.PHYSICSفیزیکابزارها
202601WO/2026/002489METHOD OF DETERMINING A COMMON POINT IN IMAGESEP2025/064036G03F 7/00ASML NETHERLANDS B.V.PHYSICSفیزیکابزارها
202601WO/2026/002576SYSTEMS AND METHODS FOR DESIGN OF A METROLOGY TARGETEP2025/065560G03F 7/00ASML NETHERLANDS B.V.PHYSICSفیزیکابزارها
202601WO/2026/002829METHOD AND SYSTEM FOR EVALUATING THE QUALITY OF A PHOTOLITHOGRAPHY MASKEP2025/067461G03F 1/84CARL ZEISS SMT GMBHPHYSICSفیزیکابزارها
202601WO/2026/003159SIMULATION-BASED DEFECT AND REPAIR SHAPE DETERMINATION FOR AN OBJECT FOR LITHOGRAPHYEP2025/068044G03F 1/74CARL ZEISS SMT GMBHPHYSICSفیزیکابزارها
202601WO/2026/003904PLASMA PROCESSING METHODJP2024/022793G03F 7/40HITACHI HIGH-TECH CORPORATIONPHYSICSفیزیکابزارها
202601WO/2026/004069PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND PRODUCTION METHOD FOR PRINTED WIRING BOARDJP2024/023398G03F 7/004RESONAC CORPORATIONPHYSICSفیزیکابزارها
202601WO/2026/004373POSITIVE PHOTOSENSITIVE COMPOSITION, COPOLYMER, CURED PRODUCT, ELECTRONIC COMPONENT, DISPLAY DEVICE, AND INFORMATION TERMINALJP2025/017492G03F 7/023TORAY INDUSTRIES, INC.PHYSICSفیزیکابزارها
202601WO/2026/004396PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND PRODUCTION METHOD FOR PRINTED WIRING BOARDJP2025/018089G03F 7/004RESONAC CORPORATIONPHYSICSفیزیکابزارها
202601WO/2026/004403ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND COMPOUNDJP2025/018217G03F 7/004FUJIFILM CORPORATIONPHYSICSفیزیکابزارها
202601WO/2026/004462RADIATION-SENSITIVE COMPOSITION AND PATTERN FORMATION METHODJP2025/019356G03F 7/004JSR CORPORATIONPHYSICSفیزیکابزارها
202601WO/2026/004498METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, AND METHOD FOR PRODUCING NITROGEN-CONTAINING COMPOUNDJP2025/020014G03F 7/11JSR CORPORATIONPHYSICSفیزیکابزارها
202601WO/2026/004652PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND PRODUCTION METHOD FOR PRINTED WIRING BOARDJP2025/021478G03F 7/075RESONAC CORPORATIONPHYSICSفیزیکابزارها
202601WO/2026/004678METHOD FOR FORMING PATTERN ON LAMINATE AND COMPOSITION USED THEREFORJP2025/021657G03F 7/11NISSAN CHEMICAL CORPORATIONPHYSICSفیزیکابزارها
202601WO/2026/004680METHOD FOR FORMING PATTERN ON LAMINATE AND COMPOSITION USED THEREFORJP2025/021670G03F 7/11NISSAN CHEMICAL CORPORATIONPHYSICSفیزیکابزارها
202601WO/2026/005162COMPOSITION FOR SEMICONDUCTOR PHOTORESIST, AND PATTERN FORMATION METHOD USING SAMEKR2024/096697G03F 7/004SAMSUNG SDI CO., LTD.PHYSICSفیزیکابزارها
202601WO/2026/005325CURABLE COMPOSITION, CURED FILM PRODUCED USING COMPOSITION, AND COLOR FILTER AND DISPLAY DEVICE COMRISING CURED FILMKR2025/007661G03F 7/033SAMSUNG SDI CO., LTD.PHYSICSفیزیکابزارها
202601WO/2026/005639METHOD FOR MATCHING STRUCTURES OF A LAYOUT OF A MICROELECTRONIC COMPONENT LAYERRU2024/000204G03F 7/075AKTSIONERNOE OBSHCHESTVO "SOFIT"PHYSICSفیزیکابزارها
202601WO/2026/006304PHOTORESIST SMOOTHENING AND PROTECTIONUS2025/035036G03F 7/40LAM RESEARCH CORPORATIONPHYSICSفیزیکابزارها
202601WO/2026/006407DEFECT REDUCTION STRATEGIES USING MECHANICAL LEARNINGS FROM MECHANICAL SIMULATIONUS2025/035188G03F 7/00LAM RESEARCH CORPORATIONPHYSICSفیزیکابزارها
202601WO/2026/006500ASSEMBLY FOR AN ULTRAVIOLET-OZONE CLEANING SYSTEMUS2025/035321G03F 1/82KLA CORPORATIONPHYSICSفیزیکابزارها